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MacDermid is the market leader in the development of high reliability bonding conversion coatings.  

The MultiBondT process is the most widely used oxide alternative system in the world

The next generation, MultiBondT LE, provides enhanced reliability and has been specifically developed for use in high technology products and with high performance laminate systems.

The process provides a wide operating window, increased copper holding capacity and excellent peel strengths on high TG substrates. Etching depths have also been reduced making it the ideal solution for controlled impedance inner layer technology.

Etch Depth

Waste Generation
  •   Lowest copper removal
  •   Exceptional impedance control results
  •   Compatible with a full range of resins, including epoxies, polyimide and hybrids
  •   Significant reduction in copper waste volume

Smooth Foil

MultiBond LE